FX-3
KE-3020
 

KE-3020

 
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Características



■Chip
20,900CPH chip (Laser centering/Optimum)
17,100CPH chip (Laser centering / IPC9850)

■ IC
9,470CPH (Vision centering/MNVC)

■ From 0402(01005) to 74mm square components or 50×150mm

■ KE-3020V
One multi-nozzle laser head (6 nozzles) plus
one IC head with CDS sensor (1 nozzle)

■ KE-3020VR
One multi-nozzle laser head (6 nozzles) plus
one IC head with FMLA sensor (1 nozzle)

■ The use of electronic double tape feeders enables mounting of a maximum of 160 component types.
■ MNVC is standard

■ High-speed, on-the-fly vision centering
(When using both high-resolution camera and MNVC)
■ High speed feeding of tray components (Option)

■ Longer sized PWB in X axis(option)

■ PoP placement(option)


 

 

 

Especificaciones


 

Board size
M size (330×250 mm)
L size (410×360 mm)
L-Wide size (510×360 mm) *1
XL size (610×560 mm)
Applicability to long PWB (L size)*2 800×360mm
Applicability to long PWB (L-Wide size)*2 1,010×360mm
Applicability to long PWB (XL size)*2 1,210×560mm
Component height
12mm
20mm
25mm(XL size)

Component size

Laser recognition 0402(01005)~33.5mm
Vision recognition Standard camera 3mm~74mm or 50×150mm
High-resolution camera 1.0×0.5mm*3~48mm or 24×72mm
Placement speed

Chip Optimum 20,900CPH
IPC9850 17,100CPH
IC*4 9,470CPH*5
Placement accuracy
Laser recognition ±0.05 mm (±3σ)
Vision recognition ±0.03mm(MNVC ±0.04mm)
Feeder inputs

Max.160 in case of 8mm tape
(on a Electric double tape feeder)*6