Características
■Chip
20,900CPH chip (Laser centering/Optimum)
17,100CPH chip (Laser centering / IPC9850)
■ IC
9,470CPH (Vision centering/MNVC)
■ From 0402(01005) to 74mm square components or 50×150mm
■ KE-3020V
One multi-nozzle laser head (6 nozzles) plus
one IC head with CDS sensor (1 nozzle)
■ KE-3020VR
One multi-nozzle laser head (6 nozzles) plus
one IC head with FMLA sensor (1 nozzle)
■ The use of electronic double tape feeders enables mounting of a maximum of 160 component types.
■ MNVC is standard
■ High-speed, on-the-fly vision centering
(When using both high-resolution camera and MNVC)
■ High speed feeding of tray components (Option)
■ Longer sized PWB in X axis(option)
■ PoP placement(option)
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